Direct Copper Bonding for Power Interconnects: Design, Manufacturing, and Test
نویسندگان
چکیده
منابع مشابه
A Unified Framework for Design Validation and Manufacturing Test
New approaches to address the diicult problems in test are necessary if its current status as a major bottleneck in the production of quality integrated circuits is to be changed. In this paper we propose a new direction for solving the test problem using powerful methods already employed for the formal veriication of large circuits. More speciically, we will discuss how abstraction techniques ...
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Inequalities in thermomechanical properties of materials at interfaces of a modern package lead to a rise in periodic stresses during normal operation, making these sites crucial to the integrity of the entire product. Proper lifetime analysis for highly miniaturized interconnects is a real challenge. In addition, broad application of 100% quality standards in various industries has caused a ra...
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ژورنال
عنوان ژورنال: IEEE Transactions on Components, Packaging and Manufacturing Technology
سال: 2015
ISSN: 2156-3950,2156-3985
DOI: 10.1109/tcpmt.2014.2376882